SOLUTION FOR LOCALIZED COOLING AND HOTSPOT ELIMINATION
The conventional approach to data center cooling using room-based cooling has practical limitations in high-density data centers. One solution is rack-level cooling: rack-based cooling strategy makes it possible to address high operating densities while maintaining redundancy characteristics.
For users with high-density server technologies, we offer In-Rack – a compact and lightweight chilled water cooling unit intended for attaching to the rear of rack cabinets. Since In-Rack handles the heat load as close to the source as possible, it consumes only a little amount of energy. Equipped with a set of redundancy options like hot-swappable fans, dual power supply, and uninterruptible power source, the In-Rack cooling door ensures the highest possible availability for mission-critical IT equipment.
MICROCHANNEL EVAPORATOR
The microchannel evaporator used in the In-Rack design allows achieving many advantages, including low airside pressure drops, higher cooling capacity, and noticeably less weight. Low weight removes limitations of the previous generations of rack-mounted cooling doors and enables the use of In-Rack cooling solution for both greenfield and retrofit applications.
The use of the microchannel evaporator coil reduces the overall unit depth without having to cut back on the unit’s cooling capacity. Besides, low airflow resistance of the coil results in little fan power consumption, improving In-Rack’s energy efficiency.
FEATURES
ADVANTAGES
HIGH COOLING DENSITY
LOW WEIGHT
SMALL UNIT DEPTH
PRODUCT SPECIFICATIONS
Capacity [kW] | 30 … 40 |
---|---|
Cooling source | CHILLED WATER |
Energy efficiency (EER) | 395 |
Fan motors | EC |
Heat exchangers | MCHE |
Cooling circuits | SINGLE |
Dew point control | AVAILABLE |
BMS connectivity | AVAILABLE |
Warranty | 3 YEARS |